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  • LITE 3025 Phenalkamide Curing Agent

    ImageLITE 3025 is a new solvent free phenalkamide for cost-effective, medium and high solids heavy-duty epoxy coatings. It is specially designed to protect surfaces from highly corrosive environments and has "drop in" compatibility with existing polyamide systems.

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  • NX-8101 Waterborne Curing Agent

    ImageNX-8101 is the first CNSL curing agent for waterborne epoxy coatings. It is designed for cost effective water-based concrete primers and self-levelers that require quick return to service, excellent adhesion to concrete and top coats, and superior durability.

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  • Beautiful Floors Using Ultra LITE 2009!

    ImageCardolite continues to pioneer the development of CNSL based materials with properties that were once unimaginable. Ultra LITE 2009 is the first phenalkamine in the market with Gardner color ≤ 1, ideal for floor top coats of all hues and shades.
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  • China International Adhesive and Sealants Expo

    Sample imageCardolite will give a presentation on CNSL products for non-metal bonding at the China Adhesive & Tape Annual Technical Conference on August 23 and will be promoting its newest products for epoxy and polyol adhesives at the 19th China International Adhesive and Sealants Expo on August 24-26 both to be held in Guangzhou, China. Please stop by our presentation and visit our booth #4B408 to learn about our new products and have an in-depth discussion.

  • 2016 China Composites Show

    Sample imageCardolite will be introducing the FormuLITE product line for composite applications at the 2016 China Composites Show on August 31-September 2, in Shanghai, China. Please visit us at booth #2227, Hall #2 and attend our technical seminar on September 1st at 10am to hear more about renewable two component epoxy systems for various composite processes.

  • World Adhesive & Sealant Conference

    Sample imageCardolite will be presenting the benefits of CNSL epoxy curing agents and polyols in adhesive applications at the World Adhesive & Sealant Conference (WAC 2016) to be held on October 25-28 in Tokyo, Japan. Please come see our presentation on October 27 and also visit our booth #14 to hear more about our product offering and technology.