ADHESION UNDER ADVERSE CONDITIONS: WET AND CONTAMINATED SUBSTRATES
CNSL-based epoxy curing agents, modifiers, and diluents are the ideal choice for creating durable bonds to challenging substrates as for example, wet or oil contaminated substrates. The hydrophobicity of CNSL products coupled with their fast cure allows adhesives to quickly develop strong bonds to wet metal, damp concrete, and low surface energy substrates without time consuming and costly substrate preparation.
Moreover, Cardolite’s phenalkamine and phenalkamide epoxy curing agents develop bond strength and cure even below zero degrees celsius while providing good working time for applicators. Force-cure industrial applications should see increased line speeds and energy savings by the use of lower cure temperatures to achieve ultimate performance.